Finance · 06/03/2025
Samsung Hires TSMC Veteran to Boost US Chip Foundry Expansion
Samsung Electronics has hired former TSMC executive Margaret Han to lead its North American foundry business, aiming to reverse losses and improve market share. The article analyzes the challenges Samsung's foundry business faces, including issues with technology yield and market share, as well as the difficulties of its "Shell-First" strategy. It explores whether Samsung can successfully turn the tables and become a more competitive player in the wafer fabrication market against industry leaders like TSMC.
Culture · 05/09/2025
Inside the Semiconductor Chip Packaging Process From Wafer to Product
This article provides an in-depth analysis of the key steps in traditional chip packaging processes, including wafer thinning, dicing, die bonding, wire bonding, and molding. It emphasizes the critical importance of each stage in enhancing chip performance and reliability.
Finance · 08/13/2025
8inch Wafer Market Faces Challenges Amid ASE Struggles Chinas Ga2o3 Advance
This article delves into the latest trends in the 8-inch wafer market. While VIS faces short-term performance pressure, its annual revenue still reaches the second highest in history. Hangzhou Gaoren Semiconductor achieves breakthroughs in Gallium Oxide. Furthermore, Pomega plans to invest in an 8-inch wafer fab, driving a strategic transformation. Overall, the 8-inch wafer market presents both opportunities and challenges, making its future development worthy of anticipation. The market shows resilience and potential for growth despite current economic headwinds and evolving technological landscapes.
Finance · 01/09/2025
Global Wafer Fab Expansion 18 New Plants by 2025 Led by US and Japan
SEMI forecasts 18 new wafer fabs will begin construction globally in 2025, with North America and Japan leading the way. This expansion is fueled by policy support, localization efforts, and growing demand from AI and HPC, driving global wafer capacity growth, particularly in advanced process technologies. Expansion in Mainland China is expected to slow down due to previous large-scale construction. The global semiconductor industry is poised for broader development prospects. This surge in capacity aims to address increasing demand and secure supply chains.
Finance · 05/27/2025
TSMC announced plans to establish a European chip design center in Munich, Germany, by the third quarter of 2025. The center aims to support European customers in designing high-performance, low-power chips, focusing on automotive, industrial, AI, and IoT applications. This initiative complements TSMC's ESMC wafer fab being built in Dresden, creating synergy and contributing to the growth of the European semiconductor industry. The design center will provide crucial design support and accelerate innovation within the European market.
Education · 07/27/2024
Chinese Scientists Break Polymer Thermoelectric Record ZT Exceeds 1
A Chinese research team has innovatively developed polymer multi-heterojunction (PMHJ) thermoelectric materials, achieving a thermoelectric figure of merit (ZT) of 1.28 at 368 K, breaking the bottleneck of ZT > 1.0 for plastic-based thermoelectric materials. This study effectively reduces lattice thermal conductivity through interface structure and size effect control. The material also exhibits excellent flexibility and large-area fabrication capabilities, paving new avenues for energy supply in flexible electronic devices. This breakthrough promises significant advancements in the field of flexible and wearable electronics.